Classes & TalksThursday, November 5
Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials
Thursday, November 5 · 7-8:30 p.m. · 1111 Engineering Drive
7-8:30 p.m.
- When
- Thursday, November 5 · 7-8:30 p.m.
- Where
- 1111 Engineering DriveBoulder, CO · 80309
About this event
Darren Hitchcock, senior business development manager, Panasonic will cover how how package and PCB material choices affect signal integrity, manufacturability, and performance in high-speed systems.
This presentation is in association with CU Boulder’s High Speed Digital Engineering (HSD) Program . We aim to connecting students, researchers, and industry professionals through technical talks on signal integrity, packaging, PCB design, interconnects, power integrity, and modern high-performance computing.
Listed by University of Colorado Boulder (Localist), gathered by the Lafayette events calendar.