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VERSION:2.0
PRODID:-//6AM City//Good Day Lafayette//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:evt_M24cM8zJ29RX-20261106T020000Z@gooddaylafayette.com
DTSTAMP:20261103T224604Z
DTSTART:20261106T020000Z
DTEND:20261106T033000Z
SUMMARY:Signal Integrity Challenges in Modern AI Computers: Package and PCB
  Materials
LOCATION:1111 Engineering Drive\, Boulder\, CO 80309
DESCRIPTION:Darren Hitchcock\, senior business development manager\, Panaso
 nic will cover how how package and PCB material choices affect signal inte
 grity\, manufacturability\, and performance in high-speed systems.\n\nhttp
 s://calendar.colorado.edu/event/signal-integrity-challenges-in-modern-ai-c
 omputers-package-and-pcb-materials
URL:https://calendar.colorado.edu/event/signal-integrity-challenges-in-mode
 rn-ai-computers-package-and-pcb-materials
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